Silicon Photonics × Optical Interconnects × AI Infrastructure

JPC Connectivity continues to focus on the development of optoelectronic integration and high-speed connection technologies. Through academic and industry exchanges, we strive to deepen our technical expertise and expand our application presence within the AI supply chain.

On March 3, we hosted a special lecture titled "Silicon Photonics for Optical Interconnect and Sensing."

We were honored to invite Professor San-Liang Lee from National Taiwan University of Science and Technology (NTUST) to share insights on:
▪ Background of PIC and Silicon Photonics Technologies
▪ Applications in Optical Communications and Optical Sensing
▪ Practical Design Case Analysis
▪ Introduction to HiSiPIC and HiSPAF Platforms
▪ Future Directions of Optoelectronic Integration

As AI computing and data center demands escalate rapidly, high-speed, low-power optical interconnect technology is becoming pivotal to the industry. Silicon Photonics will play a central role in next-generation AI infrastructure.

The event also featured a special guest speaker: Alex Wu, President of Suruga Seiki Asia-Pacific & Taiwan. Speaking from the perspective of industrial equipment and precision technology, Mr. Wu discussed current market dynamics and opportunities ranging from precision optical alignment technology to photonics packaging and testing. He elaborated on the collaboration and development within the global Silicon Photonics ecosystem, adding valuable practical and industrial insights to the lecture.